Taiwan maintains global leadership in IC wafer fab capacity

TAIPEI - Taiwan has maintained its global leadership in integrated circuit 200mm-equivalent wafer fab capacity for a fourth consecutive year, according to U.S.-based IC Insights Inc.

The semiconductor research firm says Taiwan boasted average monthly capacity of 4.13 million wafers as of December 2018. This represents a global share of 21.8%, positioning Taiwan ahead of South Korea, 21.3%; Japan, 16.8%; North America, 12.8%; and China, 12.5%.
 
China was the biggest year-on-year capacity mover, the report said, attributing the increase from 10.8% to 12.5% of global capacity to large-scale investment in new facilities and lines, as well as technology.
 
In terms of individual companies, Taiwan Semiconductor Manufacturing Co. Ltd., the world's largest pure-play foundry, account for 67% of Taiwan's capacity, while Samsung Electronics Co. Ltd. and SK Hynix Inc. comprise 94% of South Korea's capacity. The trio are also the top three capacity leaders worldwide.

www.mofa.gov.tw (ATI).